Combined spending on new and refurbished front end fab tools is expected to grow 37 percent this year and obliterate the previous record set in 2011.
IoT applications need a richer complement of memory than most MCUs offer, and the bandwidth of serial NOR flash make it a logical solution to the problem.
The increasing amount of electronics in vehicles is creating a shortage of resistors, reports EBN.
Deal enables Synopsys to offer customers seamless flow from materials to transistor by creating models for TCAD process and device simulation.
Platform based on Synopsys ARC Data Fusion IP subsystem said to simplify design, reduce costs.
Carriers laid out their plans for cellular IoT variants LTE-M and NB-IoT at last week's Mobile World Congress Americas.
Security weaknesses in the companion Flash memory to an MCU or SoC expose OEMs to the commercially damaging risk of product theft due to the cloning of reverse engineered PCB designs. Read this articl
DARPA added six programs to its Electronics Resurgence Initiative to address the problems that Gordon Moore 50 years ago predicted would loom at the end of today's silicon roadmap.
Carriers and their suppliers showed efforts in Gbit 5G and Kbit IoT networks and the handsets, smartwatches and nodes that ride them at Mobile World Congress Americas.
Chipmakers are adopting artificial intelligence to boost fab operations, and the effort is starting to pay off, according to Micron Technology.
Chipmakers are adopting artificial intelligence to boost fab operations, and the effort is starting to pay off, according to Micron Technology.
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At Germany's Geisenheim University, an agricultural institute situated in a wine region, vineyards are a test bed for the effects of rising CO2 levels on plant growth.
With a stealth-inspired delta wing to maximize buoyant lift, Johns Hopkins APL's Flying Fish drone transitions directly from underwater propulsion to flight.
The emergence of new display technology such as microLED will change not only the face of mobile devices but also the Who's Who of the display industry. The race is involving big guns like Google, App
After about three years and hundreds of billions of dollars in mergers and acquisitions, the consolidation of the global semiconductor industry is pretty much finished, according to Bill Wiseman, a se
As expected, president blocks acquisition of programmable logic vendor by venture fund with ties to China's central government.
A new approach to simulate molecules on a quantum computer successfully used six qubits on a purpose-built seven-qubit quantum processor
TSMC added process and packaging variants to its broad foundry portfolio, but one analyst said some updated results were below projections it made six months ago.
Sears will ship home appliances with Cat-M LTE modules in about a year, said an exec from the company at a gathering of cellular IoT customers and carriers.
Toshiba said it signed a memorandum of understanding to move forward with a proposal by a consortium led by Bain Capital to finalize a deal for its chip business by the end of this month.
A host of sensors inside iPhone X are responsible for 3D sensing necessary for Face ID -- including infrared camera, flood illuminator, proximity sensor, ambient light sensor, front camera and dot pro
IBM and MIT will spend $240 million over 10 years to boost artificial intelligence, focusing on Watson's health care and cybersecurity capabilities.
A host of sensors inside iPhone X are responsible for 3D sensing necessary for Face ID -- including infrared camera, flood illuminator, proximity sensor, ambient light sensor, front camera and dot pro
Apple's new flagship smartphone offers facial recognition authentication, wireless charging, optimizations for augmented reality and more... but costs $999 and up.
EEMBC expanded its benchmark suite for microcontrollers to include peripheral tests.
BrainChip released what it claims is the first hardware accelerator for spiking neural networks and is working on an ASIC that could be available within two years.
NXP tackles V2X debate, unveils partnership with Hella Aglaia, and discusses its next-generation vision processor roadmap, all the while there is an elephant in the room - Qualcomm.
Semiconductor equipment billings came in at an all-time high for the second consecutive quarter as the fab tool industry remains on track to post record sales.
Confirms it expects to use next-generation lithography technology with 7nm process next year; adds 11nm low power plus process to foundry offerings.
Those who came to a small automated vehicle event ranged from a former Microsoft executive to a simulation expert and a startup in Silicon Valley, illustrating the changing balance of power and new co
Xilinx, ARM, Cadence, and TSMC have announced a partnership to build a test chip in 7-nm FinFET process technology for delivery next year that promises to speed data center applications.
Most chips execs believe EUV lithography will be used in volume production before 2021 but mask costs continue to rise, two surveys said.
Huawei has surpassed Apple for the first time in global smartphone sales to become the new number two, a Hong Kong-based analyst said.
Even as the future of Toshiba Memory remains unclear, firms chooses Kitakami City in Japan's Iwate prefecture as site of Toshiba's next memory chip fab.
Draper Laboratory used 3-D aerosol jet printing and a unique formulation of conductive ink to prototype a circuit in a few days.
Avitas Systems and Nvidia have partnered to enable AI in inspection services for the industrial sector. Asked about the limitations of today's AI, Avitas chief said, still missing is an AI's ability t
Check out what's inside the Schneider Electric Altivar Process ATV600 class of variable speed drives (VSDs) with this latest Teardown.
In the race to get 5G cellular to market, engineers are working late and streamlining features to meet an end-of-the-year deadline.
STMicroelectronics has said that it will integrate its contactless NFC technology with MediaTek's silicon, allowing smartphone makers to design handsets supporting mobile services, including payments
Nine years after the European Union fined Intel more than $1.3 billion for antitrust violations, an appeals court tossed the case back to a lower court for re-evaluation.
After a change in leadership in July, Spin Transfer Technologies offers a slightly different model for commercializing its MRAM technology.
Investigation suspended for second time as European Commission awaits information from the two firms.
Chip sales increased in all regions and across all product categories in July, extending an impressive run for the semiconductor industry.
Startup Movandi aims to leapfrog Intel and Qualcomm with an efficient RF front-end module for 5G cellular at 28 and 39 GHz.
A dispute between Apple and Qualcomm is multi-layered, its facets all loosely connected. Among the more under-reported issues is the complex contractual relationship between the biggest customer in th
Firm makes embedded FPGA intellectual property and software available on three TSMC's nodes.
Lattice hopes president will approve $1.3 billion acquisition by Chinese firm after CFIUS recommends against it.
Firm makes embedded FPGA intellectual property and software available on three TSMC's nodes.
5G will start off as fixed-wireless access and slowly move into the handset, said an Ericsson engineer who ran the numbers at Hot Interconnects.