1 pcs
Mininum order quantity from 1PCS MSB709-RT1G
Mininum order value from 1USD
2 days
lead time of MSB709-RT1G is from 2 to 5 days
12 hours
Fast quotation of MSB709-RT1G within 12 hours
60 days
60 days full quality warranty of MSB709-RT1G
1, we will give you new and original parts with factory sealed package
2, Quality warranted: All products have to be passed our Quality Control before delivery.
2,If you need more details of MSB709-RT1G,like pictures ,package,datasheet and so on, pls email to [email protected]
Features
100% avalanche tested Intrinsic capacitances and Qg minimized High speed switching Fully isolated TO-3PF plastic package Creepage distance path is 5.4 mm (typ.) for TO-3PF MSB709-RT1G ON Semiconductor TRANS GP PNP -45V SC59
Application :Switching applications
Description
Using the well consolidated high voltage MESH OVERLAYTM process, STMicroelectronics has designed an advanced family of very high voltage Power MOSFETs with outstanding performances.The strengthened layout coupled with the company’s proprietary edge termination structure,gives the lowest RDS(on) per area, unrivalled gate charge and switching characteristics.MSB709-RT1G ON Semiconductor TRANS GP PNP -45V SC59
June 2010 Doc ID 13102 Rev 9 1/15
15
STFW3N150
STP3N150, STW3N150 MSB709-RT1G ON Semiconductor TRANS GP PNP -45V SC59
N-channel 1500 V, 6 Ω, 2.5 A, PowerMESH™ Power MOSFET
in TO-220, TO-247, TO-3PFMSB709-RT1G ON Semiconductor TRANS GP PNP -45V SC59