1 pcs
Mininum order quantity from 1PCS STGD3NB60SDT4
Mininum order value from 1USD
2 days
lead time of STGD3NB60SDT4 is from 2 to 5 days
12 hours
Fast quotation of STGD3NB60SDT4 within 12 hours
60 days
60 days full quality warranty of STGD3NB60SDT4
1, we will give you new and original parts with factory sealed package
2, Quality warranted: All products have to be passed our Quality Control before delivery.
2,If you need more details of STGD3NB60SDT4,like pictures ,package,datasheet and so on, pls email to [email protected]
Features
• 225 mW Rating on FR−4 or FR−5 Board
• Zener Breakdown Voltage Range − 2.4 V to 75 V STGD3NB60SDT4 STMicroelectronics (VA) IGBT N-CHAN 6A 600V DPAK
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 KV) per Human Body Model STGD3NB60SDT4 STMicroelectronics (VA) IGBT N-CHAN 6A 600V DPAK
• Tight Tolerance Series Available (See Page 4)
• Pb−Free Packages are Available
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily Solderable ModelId$ STMicroelectronics (VA) IGBT N-CHAN 6A 600V DPAK
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0 ModelId$ STMicroelectronics (VA) IGBT N-CHAN 6A 600V DPAK