Keeping up with Moore’s Law has required continuous investment in materials, fabrication techniques, lithography and many other areas. While we see lots of newcomers in the EDA field, we see far fewer in the fabrication side due to the large investments required. This morning, I see that Surrey NanoSystems has raised third round funding of £4.5 million (~US$7.1m).
The funds will be used to commercialize innovations in materials that include an advanced dielectric thin film for insulation applications, and a process for growing carbon-based interconnections or 'vias'.
Surrey NanoSystems has developed a new class of high performance dielectric material for inter-layer or inter-metal insulation. With an effective dielectric constant of less than 2.4, it offers an advanced alternative to current 'low k' semiconductor insulation materials. It also has the advantages of having high Young’s modulus and hardness, being non porous, and offering excellent resistance to the liquid chemicals employed in semiconductor processing - making it a robust and reliable material for IC fabrication.
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