SAN FRANCISCO—Ultratech Inc., a supplier of lithography and laser-processing systems used to manufacture semiconductors, said Thursday (June 28) it acquired the rights to a collection of chip packaging patents from IBM Corp. The purchase price was not disclosed.
The acquired patents include fundamental packaging such as C4 bumping, ball grid arrays, lead-free solders and 3-D packaging, Ultratech (San Jose, Calif.) said. The portfolio includes U.S. and foreign patents, the firm said.
Arthur Zafiropoulo, Ultratech's chairman and CEO, said in a statement that Ultratech has periodically purchased patents it views as key to its business. "The acquisition of these patents from IBM is the continuation of that strategy to ensure that our customers receive the highest technology content in their products," Zafiropoulo said.