ASMC 2012 tackles semi manufacturing challenges

ASMC 2012 tackles semi manufacturing challenges

MANHASSET, NY -- The cost of maintaining productivity at a time of limited R&D resources facing the global chip-making community will be discussed at next week’s SEMI Advanced Semiconductor Manufacturing Conference (Saratoga Hilton, Saratoga Springs, NY) .

Keynote speakers include Michael Campbell Sr. Vice President, Engineering at Qualcomm who will look at mobile wireless driving the semiconductor industry; IBM Fellow Subramanian Iyer will discuss the evolution of embedded memory at IBM; and Risto Puhakka, President of market research firm VLSI Research, Inc. will provide IC market trends and forecasts.

With limited R&D dollars, it is unclear how wafer size transition, next node scaling, new transistor technology, and 3-D IC will be funded.  A limited number of companies will pursue 450mm, but many more are looking at 3-D ICs.

A panel of executives from Globalfoundries, ASML, IBM, Applied Materials and VLSI Research will  address limited R&D funding issues.

The full program is here. Register for ASMC 2012 here.
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