MANHASSET, NY -- Ansys subsidiary Apache Design has developed its fourth-generation power sign-off EDA software package which addresses sub-20-nm designs that operate at 3 GHz. The RedHawk-3DX package also supports simulation of multi-die 3-D ICs.
“For more than a decade, RedHawk has been the industry standard for solving critical power integrity issues and is used as a sign-off solution by most of the world’s top 20 semiconductor companies,” said Andrew Yang, president of Apache Design, Inc., and vice president and general manager of Ansys, in a statement.
Apache Design provides advanced chip-level power analysis, optimization, and sign-off solutions. Sub-20nm design requirements for power and signal electromigration analyses are driving the need for a more accurate reliability sign-off solution. RedHawk-3DX’s EM modeling technologies are aware of current direction, metal topology and temperature, and support leading foundries’ 20nm EM rules. Its hierarchical extraction methodology delivers up to 40 percent speed improvement without sacrificing sign-off accuracy, according to the company.
RedHawk-3DX provides a 3-D IC extension to its earlier versions by supporting both concurrent and model-based multi-die simulations of designs with silicon interposer and through-silicon vias. The concurrent mode enables simulation of all chips including the interposer in full layout detail, whereas a model-based approach individual chips with the company’s Chip Power Model.
The software package also provides the ability to view voltage drop hotspots and other results from multiple chips in a 3-D stack-up simultaneously. This environment, in conjunction with Apache’s RedHawk Explorer, enables designers to qualify input data, review overall design weaknesses and debug specific hotspots – providing feedback that can lead to more robust designs.
In June 2011 Ansys, a system simulation company, made its intentions know to buy Apache Design Solutions for approximately $310 million in cash as a a wholly-owned subsidiary of Ansys to drive its vision to be in the simulation game for ICs, electronic packages and printed circuit boards. At that time, Andrew T. Yang, co-founder, Chief Executive Officer and Chairman of the Board for Apache expressed that “the complementary nature of our electronic and thermal product offerings provides key technological strengths."
After the deal was completed in August, Yang stayed as President of Apache Design Inc. as well as a member of Ansys' senior management team as Vice President and General Manager.
A detailed analysis of the Apache buyout shed light at the time of the deal on the challenges both companies face as they move forward in their attempts at finding synergy among its product offerings. For now Apache continues to offer its leading-edge software to its loyal customers.
More information on the synergy steps taken so far could be forthcoming by James E. Cashman III, president and chief executive officer of Ansys, when he presents a company overview and answers questions at the R. W. Baird Growth Stock Conference on May 9 at 2:30 p.m. CT. A live audio web cast and archive will be available.