EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256

 

Cyclone III FPGA Device Family Features

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EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256

 

EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256

The Cyclone? III FPGA family offered by Altera? is a cost-optimized, memory-rich FPGA family. Cyclone III FPGAs are built on Taiwan Semiconductor Manufacturing Company's (TSMC) 65-nm low-power (LP) process technology with additional silicon optimizations and software features to minimize power consumption. EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256 With this third generation in the Cyclone series, Altera broadens the number of high volume, cost-sensitive applications that can benefit from FPGAs. With a good design practice and a clear understanding of the design flow of the Cyclone III device, your design flow will be much easier. This design guideline summarizes not only the various aspects of the Cyclone III device, but also the Quartus? II software features that you should look into when designing with the Cyclone III devices. EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256

 

EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256

The Cyclone III device family offers over 5,000 logic elements (LEs) to nearly 120,000 LEs and is suitable for a wide range of applications. Always choose a device that has more LEs than the estimated count for your design requirements so that you have extra LEs either when you want to upgrade or expand your design. EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256 Consider having additional LEs and memories for debugging purposes. Additional resources also allow more flexibility with the Quartus II software for optimizing placement and routing for maximum performance, lower power consumption or both. Table 1 shows the number of LEs, memory bits, multipliers, PLLs and global clock networks for devices across the Cyclone III family.  EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256 November 2008 Altera Corporation I/O Pin Count, Package Offering and Vertical Migration The Cyclone III device family offers up to a maximum of 535 user I/O pins. Depending on your application and board layout, you can choose to use the Quad Flat Pack (QFP), FineLine Ball Grid Array (FBGA) with a 1.0 mm ball pitch or the Ultra FBGA package (UBGA) with an 0.8 mm ball pitch. EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256 The 0.8 mm ball pitch is the smallest in the Cyclone III device family and it also saves board space. Cyclone III devices support vertical migration within the same package. For a given package, the devices across different densities have the same locations for the power pins, configuration pins and dedicated pins. This allows future upgrade or changes to your Cyclone III design without having to change the board layout as you can replace the Cyclone III device in your board with another Cyclone III device of a different density. For best results, you can specify the migration device before compiling your initial design with the Quartus II software to ensure that only pins that are available in the same locations on both .Each Cyclone III I/O bank has a VREF bus to accommodate voltage-referenced I/O standards. EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256  Multiple VREF pins within an I/O bank feed the common VREF bus. Each bank can only have a single VCCIO voltage level and a single VREF voltage level at a given time. VREF is used as a reference voltage for voltage-referenced inputs (SSTL and HSTL I/O standards) to determine logic threshold. It is therefore important for VREF to be noise-free. 1 Follow pad placement guidelines in the Cyclone III Device I/O Features chapter in volume 1 of the Cyclone III Device Handbook to minimize noise coupling onto the reference voltage. Voltage deviation on the VREF pin can affect the threshold sensitivity for the input operation. If a voltage referenced input is not utilized for a VREF group, the VREF pin is released automatically by the Quartus II software for use as an I/O pin but with higher pin capacitance due to the power bus loading effects. EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256

 

EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256

Cyclone III devices support interfaces to the DDR2 SDRAM, DDR SDRAM, and QDRII SRAM. Depending on device density and package, specific side of I/O bank may support up to ×36 mode of memory interface. Supported modes in the Cyclone III devices are ×8, ×9, ×16, ×18, ×32, and ×36 modes. Use the Pin Planner tool to assist you in determining and making pin assignments for the memory interface. In general, choose the top or bottom I/O banks instead of the side I/O banks to achieve a higher clock rate for the external memory interfaces. EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256 The Cyclone III devices support external memory interfaces up to 200 MHz. Pin-Out Files The Cyclone III pin-out files contain information about the location for all the pins ofthe devices, according to package. EP3C16U256C6N Altera IC CYCLONE III FPGA 16K UFBGA256. For the I/O pins, you can also know which I/O bank and the VREF group the pins belong to. The pin-out files also contain the description for the dedicated and multi-purpose pins. The pin-out files help designer to determine the I/O pins to be used when creating the design as well as when designing the board. Apart from I/O pins, the location of dedicated and multi-purpose pins is also important during the board design stage.