SAN FRANCISCO—Claiming to offer the first phase change memory (PCM) in high-volume production, U.S. memory chip vendor Micron Technology Inc. Tuesday (July 17) announced the availability of a 45-nm multi-chip module for mobile devices featuring PCM.
Micron (Boise, Idaho) said its PCM solution for mobile devices features 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package.
PCM claims advantages over traditional memory devices in areas such as boot time, simplified software development, performance and overwrite capability. The technology is also said to be power efficient.
However, the technology has hit a number of obstacles on the road to deployment. detractors argue that it will never be cost competitive with traditional types of memory, and there are also lingering concerns about PCM's temperature sensitivity.
Micron said the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with Jedec industry standards.
Micron maintains that its PCM product line has established a foothold in the wireless industry, citing as eivdence relationships with global customers and enablers, engagement with device manufactures and cooperation with Intel Mobile Communications, which includes recent PCM qualification.
"Our commitment to innovation and continued development of advanced products to address the voracious demands of the wireless industry is clear and strong," said Tom Eby, vice president of the Wireless Solutions Group at Micron, in a statement. "We are determined to evolve and innovate by continuing to offer the best-tailored solutions for both today's and tomorrow's market requirements."
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