SAN FRANCISCO—The first production semiconductor fabs to use 450-mm wafers are projected to commence operation in 2017, according to Christian Dieseldorff, a senior analyst with the fab tool vendor trade group SEMI's industry research and statistics group.
In a presentation at the Semicon West tradeshow here Monday (July 9), Dieseldorff predicted that three 450-mm fabs would commence operation in 2017. By that time, the total number of IC production fabs will have declined to 441, down from 464 this year, according to Dieseldorf.
Number of fabs beginning operation or in production in 2007 and estimates for 2017.
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